Thick Epitaxy Stepper Method for Special-Type Device

Zhao Huan Tang; Jia Chen; Kai Zhou Tan; Bin Wang

doi:10.4028/www.scientific.net/AMR.739.222

Paper Titles

Prediction of Selected Aspects of Machinability of Austenitic Stainless Steels
p.206

Computer Extraction and Recognition Method Research on Weld Defect
p.210

Analysis of Carbonization Mechanism in ULCS Continuous Casting and Control Measures
p.214

Study on Extraction Technology of Chitin by Plant Lactobacillus Fermenting Shrimp Shell Protein
p.218

Thick Epitaxy Stepper Method for Special-Type Device
p.222

Study on the Control of Gelatinous Membrane in the Process of Vinegar Trickling Fermentation
p.226

Dependence of Mold Temperature on its Cavity Filling Time for the Production of Lightweight Profile Applying the Extrusion Technology
p.233

Micro Machining Issues: Design and Machining Process
p.238

Strength Analysis of Yacht Hull Building by VIMP
p.245

HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 739Thick Epitaxy Stepper Method for Special-Type...

Thick Epitaxy Stepper Method for Special-Type Device

Abstract:

A stepper lithography method for thick epitaxy of special-type device was proposed. In this method, a mask with both alignment mark for proximity lithography and identification mark for stepper equipment was designed to solve the problem of precise alignment to patterns before thick-layer epitaxy and stepper lithography after thick-layer epitaxy. Using this method, the accuracy for alignment of patterns before and after thick-layer epitaxy reached 0.5 μm. This pattern alignment method special for thick-layer epitaxy is also applicable for stepper lithography of VDMOS with NBL, super-junction VDMOS, high-voltage complementary bipolar device and high-voltage BCD device.