Research on Preparing Recycling Boards by Using Non-Metallic Materials of Obsolete Printed Circuit Boards

Yan Chao Zhang; Bo Liu; Wei Jing Gao; Jia Hui Zhu; Wu Biao Duan; Fei Hua Yang; Jian Ping Guo

doi:10.4028/www.scientific.net/AMR.743.199

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 743Research on Preparing Recycling Boards by Using...

Research on Preparing Recycling Boards by Using Non-Metallic Materials of Obsolete Printed Circuit Boards

Abstract:

The printed circuit boards (PCBs) are the basis of all electrical and electronic equipment (EEE) and thus are one of the most important branches of WEEE stream. Present researches mainly concentrate on the processes of reusing noble metals and copper, and a great deal of nonmetals in PCBs are disposed by combustion or filling, which may cause secondary pollution and resource-wasting. So in this paper, we study how nonmetals are used to produce recycling boards through adding different adhesives, and obtain the best formulation and working conditions. The best formulation is that the binder is Polypropylene (less than 20%), additive are methenamine (little) and stearic acid (little). Effects of working conditions on the molding results are investigated. The results show that the optimum conditions for hydraulic pressure machine are the temperatures of 160 °C, warming and pressing time of 10 minutes and the press of 30MPa.

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Periodical:

Advanced Materials Research (Volume 743)

Pages:

199-202

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.743.199

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Online since:

August 2013

Authors:

Yan Chao Zhang, Bo Liu, Wei Jing Gao, Jia Hui Zhu, Wu Biao Duan, Fei Hua Yang, Jian Ping Guo

Keywords:

Nonmetals, Printed Circuit Board (PCB), Recycling Boards

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References

[1] Richter, H.; Lorenz, W.; Bahadir, M. Examination of organic and inorganic xenobiotics in equipped printed circuits. Chemosphere. 1997, 35 (1-2): 169-179.

DOI: 10.1016/s0045-6535(97)00148-3

Google Scholar

[2] Cao, Y.; Zhao, Y.; Wen , X. The research and development status of waste electronic equipment resources.J. Environmental Pollution and Control. 2010, 25(5): 289-291.

Google Scholar

[3] Guo, J.; Xu, Z. Preparation of phenolic molding compound by nonmetals of waste PCBs.C. The 3rd International Conference on Waste Management and Technology. 2008. Beijing.

Google Scholar

[4] He, W.; Li, G.; Ma, X.; Wang, H.; Huang, J.; Xu, M.; Huang, C. WEEE recovery strategies and the WEEE treatment status in China. J. Hazard. Mater. 2006, 136, 502-512.

DOI: 10.1016/j.jhazmat.2006.04.060

Google Scholar

[5] Veit, H.M.; Bernardes, A.M.; Ferreira, J.Z.; Tenorio, J.A.S.; Malfatti, C. d.F. Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgy. J. Hazard. Mater. 2006, 137, 1704-1709.

DOI: 10.1016/j.jhazmat.2006.05.010

Google Scholar

[6] Cui, J.; Forssberg, E. Mechanical recycling of waste electric and electronic equipment: a review. J. Hazard. Mater. 2003, 99, 243-263.

DOI: 10.1016/s0304-3894(03)00061-x

Google Scholar

[7] National Plastic Standardization Technical Committee, Plastic Standard Daquan: Plastic-based standards and a common approach (2nd Edition), Standards Press of China, (2005).

Google Scholar