Study on of Cure Reaction Kinetics of Polyamide-Imide-Epoxy Resin

Hai Yang Shi; Lei Zhang; Jin Hai Cui

doi:10.4028/www.scientific.net/AMR.746.128

Paper Titles

Coating Binder Migration and its Affected Parameters: Influence of Coating Color on Binder Migration
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Influence of Coating Binder Migration on Coated Paper Optical Properties
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Microcapsule Particle Size and Size Distribution and its Influencing Factors
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Hydrolysis of BNPP Catalyzed by the Dodecyliminodiacetate Nickel (II) Complexes
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Study on of Cure Reaction Kinetics of Polyamide-Imide-Epoxy Resin
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Design-Expert Optimization of Skin-Care Material Fabrication Process
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Synthesis of P(AA-AM)/ Organic Montmorillonite Super Absorbent Resin under Focused Signal-Mode Microwave Irradiation
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Preparation, Characterization of P(AA-AM)/Organic Montmorillonite Super Absorbent Resin under Focused Signal-Mode Microwave Irradiation
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Water Quality Monitoring, Early Warning and Identification of Risk Sources of South Lake Central Ecological Park in Tangshan City
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 746Study on of Cure Reaction Kinetics of...

Study on of Cure Reaction Kinetics of Polyamide-Imide-Epoxy Resin

Abstract:

The novel polyamide-imide-epoxy resin was prepared by modification of epoxy resin with polyamide-imide. The DSC curves of the polyamide-imide-epoxy resin were obtained with different heating rates. Moreover, the curing kinetics were also studied by using Kissinger equation, Ozawa and Crane formula, the activation energy of 55.24kJ/mol was acquired, reaction order was 0.9, the frequency factor A and the reaction rate constant Kp at the peak temperature of the reaction was also obtained.