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Thermal Properties of Pressure Sensitive MF Resin Microcapsules Containing CVL

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Abstract:

The paper studied thermal properties of MF-resin microcapsules. The paper established the non-liquid release dynamics equation in ideal mode. The results indicated at 400°C or so microcapsules began to severe weight loss, which explained the heat resistance of microcapsule could completely satisfy the requirement of coating production process. The results also showed the microcapsule thermal weight loss was in line with zero-order release before 373°C, and after 373°C accorded with first-order release dynamics equation.

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Periodical:

Advanced Materials Research (Volume 746)

Pages:

321-324

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.746.321

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Online since:

August 2013

Authors:

Zhao Hui Zhen, Zheng Shun Wang

Keywords:

MF-Resin, Microcapsule, Thermal Property

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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References

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