Superhydrophobic Silicon Surface with Micro/Nanocomposite Structure Formed by 2-Step Wet Etching

Kensuke Nishioka; Takatoshi Yasui

doi:10.4028/www.scientific.net/AMR.747.542

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 747Superhydrophobic Silicon Surface with...

Superhydrophobic Silicon Surface with Micro/Nanocomposite Structure Formed by 2-Step Wet Etching

Abstract:

The micro/nanocomposite structure on silicon surface was formed by a simple 2-step chemical etching with a potassium hydroxide anisotropic etching and a stain etching in order to obtain a superhydrophobic silicon surface. Micro-sized pyramids structure was formed in a mixture of 3 wt.% potassium hydroxide with 8 vol.% isopropyl alcohol solution at 80C for 60 min. The formation of the nanosized structure was performed by stain etching at room temperature using nitric acid (HNO₃) / hydrofluoric acid (HF) aqueous solutions. The silicon surface had the superhydrophobic surface. The contact angle was measured and the maximum value was 167^o for the condition of second etching with HF : HNO₃ : H₂O = 11 : 1 : 3.

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Periodical:

Advanced Materials Research (Volume 747)

Pages:

542-546

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.747.542

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Online since:

August 2013

Authors:

Kensuke Nishioka, Takatoshi Yasui

Keywords:

Contact Angle (CA), Micro/Nanocomposite, Silicon, Superhydrophobic, Wet Etching

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