The Preparation and Microstructure of DLC Films Deposited through Plasma Electrodeposition in Water/Ethanol Solution

Abstract:

On the copper substrate the DLC films is preparated by plasma elcctrodeposition in methanol aqueous solution. The plating solution composition: alcohol water proportion is 4:1, the additive KCl content is 3g/L and the AlCl3 is trace amounts. The influence of the current density and the electrode spacing to the electrode surface bubble zone thickness, uniformity and stability are discussed in the article. The film surface morphology is observed by scanning electron microscopy (SEM). The thickness of the film D=30, 350, 410 and 380 nm. The deposition rate K=150, 175, 205 and 190 nm/h. The polycrystalline structure of the film can be observed through the X-ray diffraction (XRD) pattern., the characteristic peak of the (111),(200) and (220) crystal plane are observed at 2θ= 43.9°,50.9°and75.3°. The high carbon content is observed by EDX analysis.

• Periodical: Advanced Materials Research (Volumes 750-752)
• Pages: 2003-2007
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.750-752.2003
• Online since: August 2013
• Authors: Feng Huang, Bei Ping Luo, You Xu, Hong Xia Yu, Hu Wu
• Keywords: Current Density, Dlc Films, Electric Field Strength, Electrodeposition Parameters, Microstructure, Surface Morphology

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