Effect of Temperature Induced by Laser Irradiation Processing on Fatigue Damage Repairing for Copper Thin Film

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Abstract:

Based on laser irradiation processing experiment for repairing damaged copper thin film specimens, the effect of temperature field induced by pulsed laser surface irradiation on fatigue damage repairing of copper thin film was studied by numerical simulation method. First the temperature field of copper thin film after laser irradiation was analyzed by ANSYS under different pulse energies and pulse numbers. Then the surface morphologies of copper thin film specimens were observed by optical microscope before and after laser surface irradiation. The results showed that laser irradiation processing has a better effect on fatigue damage repairing when the temperature induced by laser surface irradiation reaches about 1200 °C. A slightly melted morphology on the surface of copper thin film was observed in this case. In addition, except for the full healing of fatigue damage, the total fatigue life was increased about 2 times at the nominal stress level of 120MPa.

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Advanced Materials Research (Volumes 750-752)

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2074-2077

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August 2013

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© 2013 Trans Tech Publications Ltd. All Rights Reserved

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[1] Neil S. Bailey, Wenda Tan, Yung C. Shin: Surface & Coatings Technology. Vol. 203 (2009), p.2003-(2012).

Google Scholar

[2] W.L. Xu, T.M. Yue, H.C. Man, C.P. Chan: Surface & Coatings Technology. Vol. 200 (2006), pp.5077-5086.

Google Scholar

[3] P. Peyre, R. Fabbro, P. Merrien, H.P. Lieurade: Material Science and Engineering. Vol. A210 (1996), pp.102-113.

Google Scholar

[4] James L. Blackshire, Larry Dosser and Ken Hix: Proceedings of the SPIE - The International Society for Optical Engineering. Vol. 5392 (2004), pp.168-178.

Google Scholar

[5] E. Altus, E. Konstantino: Materials Science and Engineering. Vol. A302 (2001): 100-105.

Google Scholar

[6] Bekir S. Yilbas and S. S. Akhtar: Materials and Manufacturing Processes. Vol. 26(2011), pp.104-112.

Google Scholar

[7] Kan Ding, Lin Ye: Journal of Materials Processing Technology. Vol. 178 (2006), pp.162-169.

Google Scholar

[8] M. Klein, A. Hadrboletz, B. Weiss, G. Khatibi: Materials Science and Engineering. A319-321(2001), pp.924-928.

Google Scholar

[9] Takao Hanabusa, Kazuya Kusaka, Osami Sakata: Thin Solid Films. Vol. 459(2004), pp.245-248.

DOI: 10.1016/j.tsf.2003.12.102

Google Scholar

[10] Chia-Lung Chang and Yow-Yi Hsieh: 5th Int. Conf. on Thermal and Mechanical Simulation and Experiments in Micro-electronics and Micro-Systems, EuroSimE 2004, pp.499-503, (2004).

DOI: 10.1109/esime.2004.1304083

Google Scholar