Analysis about Crafts and Technologies of Low-PIM and PIM Interference Testing System

Abstract:

Main low-PIM crafts were summarized, such as material requirements of major devices and special requirements of electroplating process. The setting up technologies of a PIMI testing system was discussed, for example reducing the number of connectors, isolators being used to prevent active IM and requirements of subsystem and receiver being given. Based on those crafts and technologies, a PIMI testing system was setting up with a design goal of 3rd residual PIM being-165dBc@2x43dBm. It achieved the goal with-165dBc through actual measuring after calibration.

• Periodical: Advanced Materials Research (Volumes 753-755)
• Pages: 2334-2338
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.753-755.2334
• Online since: August 2013
• Authors: Bao Guo Yang, Zun Feng Wang, Ming Tai Li
• Keywords: Non-Ferromagnetic Material, PIM, PIMI Testing System, Technology Analysis

References

[1] Lui P L. Passive Intermodulation in communication system[J]. IEEE Electronics Commu- nication Engineering, 1990. 02(6): 109-118.

[2] Hienonen S, Raisanen A V. Effect of load impedance on passive intermodulation measurements[J]. Electronics Letters. 2004. 40(4): 245-247.

DOI: 10.1049/el:20040190

[3] Zhang Shiquan. Study of Passive Intermodulation Interference at Microwave and RF Frequencies[D]. Xi'an Electronic and Science University. (2004).

[4] IEC. IEC62037-1: Passive RF and Microwave Devices, Intermodulation Level Measure. 2012. 5.

[5] Li Mingde. Generation and Prevention of Passive Intermodulation interference[J]. Electro- mechanical Components. 2005. 2(In Chinese).