A Study on a Polishing Process of Cr12 Hardening Steel with the Embedded Combined Tools

G.Y. Liu; Z.N. Guo; Jiang Wen Liu

doi:10.4028/www.scientific.net/AMR.76-78.270

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An Analytical Solution for Parameter Selection for Polishing Spherical Surfaces
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A Study on a Polishing Process of Cr12 Hardening Steel with the Embedded Combined Tools
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 76-78A Study on a Polishing Process of Cr12 Hardening...

A Study on a Polishing Process of Cr12 Hardening Steel with the Embedded Combined Tools

Abstract:

This paper presents a electrochemical-mechanical combined polishing progress of Cr12 hardening steel with a new kind of embedded tool. The embedded tool has been composed of two parts, the metal base acting as electrode and the inlayer with electroplating diamond grains on its outside surface which serves as mechanical grinding abrasive. The two parts are agglutinated by adhesive which can keep a good insulation of the inlayer during the mechanical process. The inter-electrode gap can be changed by altering the metal base and inlayer’s diameter. Through the investigation of numerical simulation and polishing experiment, it can be found that lower feed, reciprocate speed, longer trip of reciprocating, smaller diamond grains make better surface quality.

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Periodical:

Advanced Materials Research (Volumes 76-78)

Pages:

270-275

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.76-78.270

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Online since:

June 2009

Authors:

G.Y. Liu, Z.N. Guo, Jiang Wen Liu

Keywords:

Electrochemistry, Embedded, Grind, Inlayer, Reciprocate

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References

[1] Z.N. Guo, J.W. Liu and F.Z. Zeng: Key Eng. Mater. Vol. 555-560 (2005) , p.291.

Google Scholar

[2] Vladimir M V, Victor V L.: J. Mater. Process. Tech., Vol. 109 (2001), p.314.

Google Scholar

[3] Z.N. Guo, M.Z. Chai, Z.G. Huang, J.W. Liu: Proceedings of the ISEM XV, 2007, p.345.

Google Scholar

[4] Z.N. Guo, Guoyue Liu, Jiangwen Liu: Proceedings of the 8th Asia-Pacific Conference on Materials Processing (2008), Edited by Chengyong Wang/Xiaoping Li /Jun Wang, p.528.

Google Scholar

[5] Zhu Shuming, Chen Yuannong: Electrochemical process technology, Chemistry Industry Press, Beijing (2001), p.303.

Google Scholar

[6] Wang Jianye, Xu Jiawen: Electrochemical principle and application, National Defence Industry Press, Beijing (2001), p.284.

Google Scholar

[7] HenHanwei., HuYuehua, Zhou Kecao: Trans. Nonferrous M e. Soc. China, Aug. 2003, p.28.

Google Scholar

[8] Kuang, X.M.: Zhao, W.X.; Wang, X. B: Key Eng. Mater, Vol. 258-259 (2004), p.82.

Google Scholar

[9] Tillmann, W.: Osmanda. A. M: Mate. Sci. Forum, v 502, 2005, p.425.

Google Scholar

[10] LiuDong-Ping, LiuYan-Hong, ChenBao-Xiang: Chinese Physics, v 15, n 3, March 2006, p.575.

Google Scholar