Molecular Dynamics Simulation of Chemo-Mechanical Grinding (CMG) by Controlling Interatomic Potential Parameters to Imitate Chemical Reaction

Abstract:

This paper reports a molecular dynamics simulation of chemo-mechanical grinding (CMG) of silicon wafer by controlling the interatomic potential parameters to imitate the chemo-mechanical or mechano-chemical reactions between an abrasive grain and a Si wafer. Some comparisons between diamond grinding and CMG were made by using the proposed simulation model. From the simulation results, reductions of surface damages, wears of abrasive grain and scratching forces in CMG were confirmed to be same as observed in actual experiments by a CeO2 abrasive wheel, and the availability of proposed simulation model was verified.

• Periodical: Advanced Materials Research (Volumes 76-78)
• Pages: 82-87
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.76-78.82
• Online since: June 2009
• Authors: Jun Shimizu, Li Bo Zhou, Takeyuki Yamamoto
• Keywords: Chemo-Mechanical Grinding (CMG), Interatomic Potential, Molecular Dynamic (MD), Silicon Wafer, Subsurface Damage, Tool Wear

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