Research on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 1: Mechanism Study

Xue Kun Li; Lan Yan; Waleed Bin Rashid; Yi Ming Rong

doi:10.4028/www.scientific.net/AMR.76-78.9

Paper Titles

Temperature Fields in Workpieces during Grinding-Hardening with Dry Air and Liquid Nitrogen as the Cooling Media
p.3

Research on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 1: Mechanism Study
p.9

Research on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 2: Factorial Study
p.15

Effects of Vibration-Assisted Grinding on Wear Behavior of Vitrified Bond Al₂O₃ Wheel
p.21

Influence of Particle Effects on the Material Removal Rate Utilizing Electrokinetic Phenomenon
p.27

Diamond Tools for the Grinding of Complex Ceramic Implant Surfaces
p.33

Optimization of Coated SiC Belt Grinding of Alumina Ceramics
p.38

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 76-78Research on Microscopic Grain-Workpiece...

Research on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 1: Mechanism Study

Abstract:

Grinding is regarded as a special multiple edge cutting process, which can be decomposed into grain-workpiece interface, chip-workpiece/bond interface, and bond-workpiece interface at microscopic level. The grain-workpiece interface, which resembles a micro-cutting process, directly modifies the workpiece surface and dominates all the output measures of a grinding process. Therefore, the study of the grain-workpiece interaction through micro-cutting analysis becomes necessary. As the emergence of the packaged FEM software for micro-cutting simulation, apart from single grit cutting test, it enables another qualitative and quantitative investigation method on grain-workpiece interface mechanism in an efficiency and effective manner. In this paper, the efficacy of the commercialized cutting simulation software Third Wave AdvantEdgeTM is evaluated, and the possibility of using AdvantEdgeTM for in-depth understanding of grain-workpiece interface as well as grinding process modeling is studied, too.