Research on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 1: Mechanism Study
Grinding is regarded as a special multiple edge cutting process, which can be decomposed into grain-workpiece interface, chip-workpiece/bond interface, and bond-workpiece interface at microscopic level. The grain-workpiece interface, which resembles a micro-cutting process, directly modifies the workpiece surface and dominates all the output measures of a grinding process. Therefore, the study of the grain-workpiece interaction through micro-cutting analysis becomes necessary. As the emergence of the packaged FEM software for micro-cutting simulation, apart from single grit cutting test, it enables another qualitative and quantitative investigation method on grain-workpiece interface mechanism in an efficiency and effective manner. In this paper, the efficacy of the commercialized cutting simulation software Third Wave AdvantEdgeTM is evaluated, and the possibility of using AdvantEdgeTM for in-depth understanding of grain-workpiece interface as well as grinding process modeling is studied, too.
Han Huang, Liangchi Zhang, Jun Wang, Zhengyi Jiang, Libo Zhou, Xipeng Xu and Tsunemoto Kuriyagawa
X. K. Li et al., "Research on Microscopic Grain-Workpiece Interaction in Grinding through Micro-Cutting Simulation, Part 1: Mechanism Study", Advanced Materials Research, Vols. 76-78, pp. 9-14, 2009