[1]
Walther M, Rehm R, Schmitz J et al., InAs/GaSb type II superlattices for advanced 2nd and 3rd generation detectors [J], Proc. SPIE, 2010, 7608: 76081Z.
DOI: 10.1117/12.842065
Google Scholar
[2]
Rogalski A, Material consideration for third generation infrared photon detector [J], Infrared Physics and Technology, 2007, 50: 240-252.
DOI: 10.1016/j.infrared.2006.10.015
Google Scholar
[3]
Chen Huijuan, Guo Jie, Ding Jiaxin et al., Study of mesa etching for a InAs/GaSb superlattice infrared detector [J]. Micronanoelectronic Technology, 2008, 45(5): 297-301.
Google Scholar
[4]
Mikami H, Hatayama T, Yano H et al. Role of hydrogen in dry etching of silicon carbide using inductively and capacitively coupled plasma [J]. Jpn. J. Appl. Phys. 2005, 44: 3817-3821.
DOI: 10.1143/jjap.44.3817
Google Scholar
[5]
Lee H, Kwon B, Kim H, et al. Etching characteristics of ZnO and Al-doped ZnO in inductively coupled Cl2 and BCl3 plasmas [J]. Jpn. J. Appl. Phys. 2008, 47: 6960-6964.
DOI: 10.1143/jjap.47.6960
Google Scholar
[6]
H. Lee, B. Kwon, H. Kim, et al. Etching damages on AlGaN, GaN and InGaN caused by hybrid inductively coupled plasma etch and photoenhanced chemical wet etch by schottky contact characterizations [J]. Jpn. J. Appl. Phys. 2003, 42: 4207-4212.
DOI: 10.1143/jjap.42.4207
Google Scholar
[7]
Guo J, Sun W, Xu Y, et. al., Growth and charaterization of short period InAs/GaSb superlattices photoconductors [J], Proc. of SPIE, 2008, 7055: 70550U.
Google Scholar
[8]
T. HONG, Y. ZHANG, T. LIU. Reactive Ion Etching of GaAs , GaSb , InP and InAs in Cl2/ Ar Plasma [J]. Semiconductor Photonics and Technology, 2004, 10: 203-207.
Google Scholar
[9]
Su H, Sun G, Effect of the OH ions on SiO2/ PSG/ SiO2/InSb device stability [J]. Proc of SPIE. 1994, 2274: 181-190.
Google Scholar
[10]
Schirm K, Soukiassian P, Mangat P, et al. Role of defects in the passivation of III–V semiconductor surfaces modified by alkali metals: O2/Rb/p- and n-type GaSb(110) [J]. J. Vac. Sci. Technol. B, 1992, 10: 1867.
DOI: 10.1116/1.586214
Google Scholar