The Effect of Grain Size and Cl-Concentration on the Passive Behavior of Cu in Borate Buffer Solution

Qi Jun Zhong; Li Bin Yu; Yi Xiao; Yi Wang; Qiong Yu Zhou; Qing Dong Zhong

doi:10.4028/www.scientific.net/AMR.785-786.928

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 785-786The Effect of Grain Size and Cl-Concentration on...

The Effect of Grain Size and Cl^-Concentration on the Passive Behavior of Cu in Borate Buffer Solution

Abstract:

Effect of grain size and Cl^- concentration on corrosion behavior of Cu was investigated by using a series of electrochemical analysis in borate buffer solution (pH=8.40).The results indicated that in all cases, the Mott-Schottky plots of the passive films on the surface of Cu were linear with negative slop, and showed behavior of the p-type semiconductor.With the decrease of the grain size and the increase of anode passivation potential, the acceptor density (N_A) of the passivation film on the surface of Cu was reducing. As the concentration of Cl^- in the medium solution was heightening, the acceptor density (N_A) of the passivation film on the surface of Cu was increasing.

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Periodical:

Advanced Materials Research (Volumes 785-786)

Pages:

928-932

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.785-786.928

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Online since:

September 2013

Authors:

Qi Jun Zhong, Li Bin Yu, Yi Xiao, Yi Wang, Qiong Yu Zhou, Qing Dong Zhong*

Keywords:

Cl^- Concentration, Grain Size, Mott-Schottky Analysis, Passive Films

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