Simulation Analysis on Vibration Mode of X-PLY Corrugated Paperboard in Transportation Engineering

Abstract:

X-PLY Corrugated Paperboard is a new type of cushioning packaging materials, which has a light weight, strength and stiffness and other advantages, usually be made into cushioning pads (pieces) and used in the field of logistics and transport packaging to protecting internal product from shock and vibration. In the actual logistics process,external vibration excitation is often caused package resonance and lead to final damage of the package, so understanding the package natural frequencies and mode shapes, which can avoid package resonance factors causing unnecessary losses. By using of Lanczos modal analysis method in ANAYS simulation software, we obtains the first-fourth natural frequency and vibration mode of X-PLY (A) corrugated paperboard cushion pads under three different static stress. By compared simulation results with the previous experimental results, it can be referenced for the promotion and application of X-PLY corrugated board in the field of Cushioning packaging.

• Periodical: Advanced Materials Research (Volumes 791-793)
• Pages: 1084-1087
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.791-793.1084
• Online since: September 2013
• Authors: Rong Hou Xia, Yan Feng Guo, De Qiang Sun, Da Bin Chen
• Keywords: Natural Frequency, Simulation Analysis of Vibration Mode, Vibration Mode, X-PLY Corrugated Paperboard

References

[1] G. X. Peng,S. N. Pan and G. B. Jin. Beijing：Printing Industry Press (1999).

[2] H. Y. Wu. Beijing：National Defence Industry Press (1989).

[3] Y. F. Guo,Y. G. Fu,W. C. Xu and S. N. Pan．Packaging Engineering, Vol. 28 (2007), pp.6-9.

[4] Y. Liu,Z. L. Wang and J. W. Zhou. Packaging Engineering, Vol. 24 (2003), pp.43-45.

[5] Y. Liu,Z. L. Wang and D. Gao. Packaging Engineering, Vol. 25 (2004), pp.162-164.

[6] M. Sek and J. Kirkpatrick. Packaging Technology and Science, Vol. 10 (1997), pp.87-94.

[7] M. Sek and J. Kirkpatrick. Proceedings of 10th IAPRI World Conference on Packaging, Australia, Melbourne, (1997), pp.257-266.

[8] W. C. Xu. Packaging Engineering, Vol. 18 (1997), pp.78-79.

[9] D. Gao,J. Dong and J. Liu. Packaging Engineering, Vol. 27 (2006), pp.10-11.

[10] H. T. Wang,D. Gao and J. Chang. Packaging Engineering, Vol. 27 (2006), pp.1-3.

[11] Y. G. Fu. Xi'an: Xi'an University of Technology ( 2005).

[12] Y. F. Guo and W. Zhang. Packaging Engineering, Vol. 23 (2002), pp.6-8.

[13] J. Li and Y. F. Guo. Packaging Engineering, Vol. 29 (2008), pp.71-73.

[14] Q. Zhu and Y. F. Guo. Packaging Engineering, Vol. 29 (2008), pp.25-27.