Research on Subsurface Damage Layer Detection during Substrate Processing

Hai Zhou; Xiao Ming Xu; Xiang  Gao; Huan Feng

doi:10.4028/www.scientific.net/AMR.797.673

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 797Research on Subsurface Damage Layer Detection...

Research on Subsurface Damage Layer Detection during Substrate Processing

Abstract:

Double-substrate angle polishing is presented for detecting depth of sub-surface damage layer during sapphire substrate grind process. Bimorph overlap bond is used in the double-substrate angle polishing, and when measuring the beveled corrosion crack, measurement errors caused by the traditional angle polish which results in fussy boundaries between polished bevel and the edge of the original wafer plane is avoided. Also digital length measurement is used to measure specimens polished bevel machining contours, then calculate accurate slant angles, eliminate errors of inaccurate angle values and improve measurement accuracy. This experiment has tested the length of mono-crystal polished bevel crack is 175um, the angle of slant is 4.85°. According to theoretical calculation, the double-sided grinding substrate subsurface damage layer is 15um, and the depth of double-sided crystal surface is about 30um. Grinding parameters: 320# boron carbide aqueous solution, lapping pressure 110g/cm², grinding speed 30r/min.

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Periodical:

Advanced Materials Research (Volume 797)

Pages:

673-678

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.797.673

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Online since:

September 2013

Authors:

Hai Zhou, Xiao Ming Xu, Xiang Gao, Huan Feng

Keywords:

Angle Polishing, Crack, Grinding, Substrate, Subsurface Damage

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References

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