Cu2+ Removal by Hydroxyapatite Nanorods Prepared by Surfactant-Templated Method

Shao Hong Wang; Jian Guo Xia; Mei Han Wang; Zhao Xia Hou; Xiao Dan Hu; Yu Tong Guan; Dan Zhou

doi:10.4028/www.scientific.net/AMR.807-809.1258

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 807-809Cu2+ Removal by Hydroxyapatite Nanorods Prepared...

Cu²⁺ Removal by Hydroxyapatite Nanorods Prepared by Surfactant-Templated Method

Abstract:

Nanohydroxyapatite (HA) with rod-like shape was synthesized by a cationic surfactant-templated method. Batch adsorption experiments were conducted to investigate its copper adsorption property from aqueous solution. The effect of initial copper ion concentration and contact time were studied. Results showed that HA adsorption capacity increased from 25.6 mg/g to 81.4 mg/g with the increase of initial copper ion concentration from 20 mg/L to 200 mg/L. Meanwhile, the removal efficiency decreased from 64.1% to 20.3%. Moreover, it also revealed that the removal efficiency of Cu²⁺ increased with the increasing contact time and the initial adsorption process is rapidly increased within 15 min and the equilibrium was attained after 15 min.

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Periodical:

Advanced Materials Research (Volumes 807-809)

Pages:

1258-1261

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.807-809.1258

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Online since:

September 2013

Authors:

Shao Hong Wang, Jian Guo Xia, Mei Han Wang, Zhao Xia Hou, Xiao Dan Hu, Yu Tong Guan, Dan Zhou

Keywords:

Adsorption, Copper Ion, Hydroxyapatite (HA)

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