Predictive Modeling of Oxide Layer Thickness in Ultrasonic-ELID Multiplicate Grinding

Xiao Feng Jia; Bo Zhao; Ping Yan Bian

doi:10.4028/www.scientific.net/AMR.815.86

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 815Predictive Modeling of Oxide Layer Thickness in...

Predictive Modeling of Oxide Layer Thickness in Ultrasonic-ELID Multiplicate Grinding

Abstract:

The oxide layer formed and removed on the surface of the grinding wheel has a significant influence on the grinding quality of ultrasonic-ELID multiplicate grinding. In this paper on the basis of the principles of electrochemical and ultrasonic vibration, the mechanisms of oxide layer formation and remotion were analyzed. Then, the predictive modeling of oxide layer thickness was proposed. The effects of main factors on the oxide film thickness were simulated and analyzed theoretically. The simulation results show that the layer thickness decreases with the decrease of the duty ratio or the grain volume ratio or the ultrasonic frequency ,and the increase of the electrode gap during the composite grinding process.

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Progress in Materials Science and Engineering: ICMSE 2013

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Periodical:

Advanced Materials Research (Volume 815)

Pages:

86-92

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.815.86

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Online since:

October 2013

Authors:

Xiao Feng Jia, Bo Zhao, Ping Yan Bian

Keywords:

ELID, Multiplicate Grinding, Oxide Layer, Thickness Model, Ultrasonic

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