Effect of Silver Content on Bulk Properties and Interfacial Morphology of Sn-xAg-Cu Solders

Ping Li; Xiao Long Gu; Xiao Gang Liu; Hai Feng Zhong

doi:10.4028/www.scientific.net/AMR.818.83

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 818Effect of Silver Content on Bulk Properties and...

Effect of Silver Content on Bulk Properties and Interfacial Morphology of Sn-xAg-Cu Solders

Abstract:

The bulk microstructure, melting behavior, mechanical property, and interfacial Intermetallic compound (IMC) morphology were investigated on Sn-Ag-Cu (SAC) lead free solders with different Ag content (0.3,1.0,2.0,3.0,3.8wt%). The result indicates that SAC solders with higher Ag content present finer and denser intermetallic particles in the bulk solder, as a result that the tensile strength of SAC solders increased with the increasing of Ag content, while the ductility decreased. The melting temperature of SAC305 and SAC387 solders are close to eutectic point from the narrow melting range. It was found that the interfacial IMC morphology didnt appear obvious difference regardless of Ag content for as-soldered. Furthermore, the higher Ag contained solders present smaller IMC grain at the interface of aged joints and all aged joints have a tendency of polyhedron morphology.

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Advanced Materials Research (Volume 818)

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83-87

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https://doi.org/10.4028/www.scientific.net/AMR.818.83

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September 2013

Authors:

Ping Li, Xiao Long Gu, Xiao Gang Liu, Hai Feng Zhong

Keywords:

IMC, Microstructure, Sn-Ag-Cu, Tensile Strength

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