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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 833Study on Electrical Properties and Morphology...

Study on Electrical Properties and Morphology Behaviors of Epoxy Nanocomposites with Octa(3-aminopropyl)Polyhedral Oligomeric Silsesquioxane

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Abstract:

In this work, octa(3-aminopropyl)polyhedral oligomeric silsesquioxane (Oap-POSS) [(NH₂CH₂CH₂CH₂)₈Si₈O₁₂] was synthesized through hydrolytic condensation of (3-aminopropyl)triethoxysilane, and incorporated into epoxy resin (EP) cured with methyl hexahydrophthalic anhydride (MHHPA) to offer a series of novel POSS/EP nanocomposites. The microstructure, thermal stabilities, electric insulation and dielectric behaviors of the epoxy nanocomposites were studied. The results showed that the thermal stability and dielectric property of the POSS/EP increases with the incorporation of Oap-POSS into EP.

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Dianchi Advanced Materials Forum 2013

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Periodical:

Advanced Materials Research (Volume 833)

Pages:

360-364

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.833.360

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Online since:

November 2013

Authors:

Xing Dong, Ji Fang Fu, Wen Qi Yu, Li Ya Chen, Li Yi Shi, Hai Sen Jia, Song Gang Chai

Keywords:

Dielectric Property, Epoxy Resin (ER), Hybrid, Nanocomposite, POSS, Thermal Stability

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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