Impact of the Phosphors on the Conformal Coating LED by Optical Simulation

Article Preview

Abstract:

The conformal coating phosphor converted light emitting diode (LED) is one of the important high power white LED. The thickness, concentration and concentration distribution of the phosphor layer has a critical influence on the LED optical performance. Previous literature mainly focus on the luminous flux of the LED. Few are involved with the relationship between the concentration and the correlated color temperature (CCT), and angular color uniformity (ACU) of LED. Based on the ray-tracing simulation, the luminous flux, CCT and ACU affected by the phosphor thickness, concentration and concentration distribution were obtained and studied. The results provide effective references for the phosphor coating process design and optical performance analysis of conformal coating LED.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 834-836)

Pages:

1167-1171

Citation:

Online since:

October 2013

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] H. Ye, Sau Koh, C. A. Yuan, G. Q. Zhang: 2012 International Conference on Electronic Packaging Technology & High Density Packaging, Guilin (2012), p.1535-1539Guilin, (2012).

DOI: 10.1109/icept-hdp.2012.6474899

Google Scholar

[2] Y. Renyong, J. Shangzhong, C. Songyuan, L. Pei: Photonics Technology Letters, IEEE. 2010, 22(23), 1765-1767.

DOI: 10.1109/lpt.2010.2085080

Google Scholar

[3] Y. H. Won, H. S. Jang, K. W. Cho, Y. S. Song, D. Y. Jeon, H. K. Kwon: Opt Lett. 2009, 34(1), 1-3.

Google Scholar

[4] Run Hu, Xiaobing Luo, Sheng Liu: Photonics Technology Letters. 2011, 23(22), 1673-1675.

Google Scholar

[5] Zong-Yuan Liu, Sheng Liu, Kai Wang, Xiao-Bing Luo: IEEE Transactions on Components and PackagingTechnologie. 2010, 33(4), 680-687.

Google Scholar

[6] Christian Sommer, Frank Reil, Joachim R Krenn, Paul Hartmann, Peter Pachler, Stefan Tasch, Franz P Wenzl: J Lightwave Techno. 2010, 28(22), 3226-3232.

Google Scholar

[7] Zongyuan Liu, Sheng Liu, Kai Wang, Xiaobing Luo: IEEE Transaction on Device and Materials Reliability. 2009, 9(1), 65-73.

Google Scholar

[8] Yuan-Chang Lin, Jiun Pyng You, Nguyen T. Tran, Yongzhi He, F. G. Shi: Journal of Electronic Packaging. 2011, 1(133), 11009.

Google Scholar