Investigation of Process Performances and Cut Surface Characteristics in the Wire-EDMing of Silicon

Abstract:

Wire-EDMing process has been more accepted for cutting and slicing silicon wafer as it can provide a cut with less crack and chipping due to low effect of mechanical stresses. In order to provide a deep analysis of the process, the wire-EDMing performances and cut surface characteristics of p-type (100) monocrystalline silicon wafer have been experimentally investigated in this study. The results have shown that wide kerf width, high material removal rate, large electrode wear and rough cut surface can be obtained under the condition of high open voltage and rough cutting mode. Some micrographs of cut surface morphology have been also reported and discussed, where many craters and small holes can be apparently seen on the machined surface.

• Periodical: Advanced Materials Research (Volume 845)
• Pages: 950-954
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.845.950
• Online since: December 2013
• Authors: J. Punturat, Viboon Saetang*, Chaiya Dumkum
• Keywords: Electrode Wear, Material Removal Rate (MRR), Silicon, Surface Morphology, Wire-EDM

References

[1] D. Reynaerts, P.H. Heeren and H. Vanbrussel, Microstructuring of silicon by electrical discharge machining (EDM) 1. Theory, Sensors and Actuators A Physical 60(1-3) (1997), pp.212-218.

DOI: 10.1016/s0924-4247(97)01359-9

[2] T. Masaki, K. Kawata and T. Masuzawa, Micro electro-discharge machining and its applications, Proceedings - IEEE Micro Electro Mechanical Systems (1990), pp.21-26.

DOI: 10.1109/memsys.1990.110240

[3] Y.F. Luo, C.G. Chen and Z.F. Tong, Investigation of silicon wafering by wire EDM, Journal of Material Science 27(21) (1992), pp.5805-5810.

DOI: 10.1007/bf01119742

[4] Y. Uno, A. Okada, Y. Okamoto and T. Hirano, Wire EDM slicing of monocrystalline silicon ingot, Procs. of the 15th American Society for Precision Engineering Annual Meeting (2000), pp.172-175.

DOI: 10.1007/0-306-47000-4_42

[5] Y. Uno, A. Okada, Y. Okamoto and T. Hirano, High performance slicing method of monocrystalline silicon ingot by wire EDM, Proc. of 10th Intl. Conf. on Precision Engineering (2001) pp.219-223.

DOI: 10.1007/0-306-47000-4_42

[6] B.H. Yu, H.K. Lee, Y.X. Lin, S.J. Qin, F.Y. Huang and B.H. Yan, Study of wire electrical discharge machining for poly-silicon, Asian Symposium for Precision Engineering and Nanotechnology (2009).

[7] W.J. Peng and Y.S. Liao, Study of electrical discharge machining technology for slicing silicon ingots, Journal of Material Processing Technology 140 (2003), pp.274-279.

DOI: 10.1016/s0924-0136(03)00718-0

[8] P. Huijun, L. Zhidong, G. Lian, Q. Mingbo and T. Zongjun, Study of small holes on monocrystalline silicon cut by WEDM, Materials Science in Semiconductor Processing 16(2) (2013), pp.385-389.

DOI: 10.1016/j.mssp.2012.09.006

[9] T. Magara, H. Yamada, S. Sato, T. Yatomi and K. Kobayashi, Improvement of surface quality by non-electrolysis wire-EDM, J. of Japan Society for Precision Eng. (JSPE) 59(7) (1993), p.1157–1162.

DOI: 10.2493/jjspe.59.1157

[10] Aristech, Wire-cut EDM Operation Manual D Series W5F (2011).