University Server Room Creep Corrosion Prevention

Abstract:

Finance and economics university practice teaching with teaching software platform based on network, the software platform to the large server to run the computer room environment, the server determines the success of practice teaching. Creep corrosion can lead to the production of lead-free process card function failure, cause the server can not operate normally. This paper analyzes on the creep corrosion the mechanism analysis, the conditions of. At the same time according to the proposed scheme, the high humidity and high sulfur environment of computer lab and practice prove, through the control room environment, to eliminate creep corrosion.

• Periodical: Advanced Materials Research (Volume 852)
• Pages: 111-114
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.852.111
• Online since: January 2014
• Authors: Lian Cheng Li
• Keywords: Creep Corrosion, Non-Plumbum Process, Room Environment

References

[1] Mazurkiewicz P. Accelerated corrosion of printedcircuit boards due to high levels of reduced sulfurgasses in industrial environments[C]. Proceedings ofthe 32nd International Symposium for Testing and Failure Analysis, Austin, TX, USA, 2006: 469-473.

DOI: 10.31399/asm.cp.istfa2006p0469

[2] Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003, The restriction of the use of certain hazardous substances in electrical and electronic equipment[S].

[3] Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003, The restriction of the use of certain hazardous substances in electrical and electronic equipment[S].

[4] Cullen D, Kline B, Moderhock G, et al. Effects of surface finish on high frequency signal loss using various substrate materials[C]. Proceedings of IPC Expo, Anaheim, CA, USA, (2001).

[5] Barbetta M. The search for the universal surface finish[J]. Printed Circuit Design & Manufacture, 2004, 21(2): 34-38.

[6] United States Environmental Protection Agency. EPA-744-R-01-001, alternative technologies for surface finishing: cleaner technologies for printed wiring board manufacturers[S]. 2001: 1-42.

[7] Mazurkiewicz P. Accelerated corrosion of printed circuit boards due to high levels of reduced sulfur gasses in industrial environments[C]. Proceedings of the 32nd International Symposium for Testing and Failure Analysis, Austin, TX, USA, 2006: 469-473.

DOI: 10.31399/asm.cp.istfa2006p0469

[8] Cullen D. Surface tarnish and creeping corrosion on Pb-free circuit board surface finishes[C]. IPC Works, Las Vegas, USA, (2005).

[9] Xu C, Flemming D, Demerkin K. Corrosion resistance of PWB surface finishes[C]. Alcatel-Lucent, Apex, Los Angeles, CA, USA, (2007).