Dynamic Thermal Properties of Uninsulated Rammed Earth Building Envelopes

Miloslav Bagoňa; Clayton Stone; Jozef Šimiček

doi:10.4028/www.scientific.net/AMR.855.85

Paper Titles

The Results of Experimental Chamber Temperature Measurements for a Light-Weight Wooden Envelope
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Renewal of Panel Residential Houses from the Point of View of Energy Criterion
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Long Time Testing of Temperature Parameters of Wooden Lightweight External Walls
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Long Time Testing of Temperature Parameters in Selected Windows
p.81

Dynamic Thermal Properties of Uninsulated Rammed Earth Building Envelopes
p.85

Renewal of Envelope Constructions of Panel Residential Houses as a Tool for Elimination of Hygienic Problems of Thermal Bridges
p.89

Physical Assessment of a Window Using a Computer Simulation
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Importance of Envelope Construction Renewal in Panel Apartment Buildings in Terms of Basic Thermal Properties
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Program for Quantification Temperature and Aerodynamic Mode of Double-Skin Facade
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 855Dynamic Thermal Properties of Uninsulated Rammed...

Dynamic Thermal Properties of Uninsulated Rammed Earth Building Envelopes

Abstract:

The paper demonstrates the thermal admittance procedure as a technique to quantify the dynamic thermal properties of two uninsulated rammed earth building components subjected to radiative and conductive heat transfer processes. With the aid of Australian climate data and a climate chamber, this research paper uses a dynamic thermal property calculator developed by Arup in accordance with EN ISO 13786:2007 to quantify the performance of a homogenous rammed earth envelope subjected to in-situ measurements that mimic real conditions.

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Advanced Building Construction and Materials 2013

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Periodical:

Advanced Materials Research (Volume 855)

Pages:

85-88

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.855.85

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Online since:

December 2013

Authors:

Miloslav Bagoňa, Clayton Stone*, Jozef Šimiček

Keywords:

Admittance, Decrement, Density of Heat Flux, Specific Heat, Surface Factor

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References

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DOI: 10.4028/www.scientific.net/amr.649.85

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