Optimization of Process Parameters of Diffusing Bonding of Titanium with Titanium and Titanium with Copper

Abstract:

The diffusion bonding of Ti to Ti, Ti-Cu alloy at different temperatures ranging from 673 K to 923 K under an applied stress of 100 MPa for 1 h was studied. The observation of the microstructure reveals that sound joints between the Ti-Ti and dissimilar titanium/Copper metals sheet were successfully joined by diffusion bonding process. Ti-Cu alloy without any pores or cracks can be achieved through diffusion bonding at temperatures over 873 K under the applied stress of 100 MPa for 1 h. The bond is composed of the zones, and its width increases with the increase of bonding temperature. The Micro hardness at the interface of joints bonded under different conditions was evaluated through Micro hardness testing and the fracture mode was analyzed by SEM observation.

• Periodical: Advanced Materials Research (Volume 856)
• Pages: 153-158
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.856.153
• Online since: December 2013
• Authors: Kasigavi Chandrappa, Joel Hemanth
• Keywords: Copper Alloy Sheet, Diffusion Bonding, Hot Press, Microhardness, Roughness SEM, Surface, Titanium Alloy Sheet

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