Thermal Conductivity Enhancement in a Latent Heat Storage Device

Abstract:

High conductivity porosity materials are proposed to enhance the phase change materials (PCM) in order to solve the problem of low conductivity of PCM in the latent heat storage device (LHSD), and two-dimensional numerical simulation is conducted to predict the performance of the PCM by CFD software. During the phase change process, the PCM is heated from the solid state to the liquid phase in the process of melting and from the liquid phase to the solid state in the solidification process. The results show that porosity materials can improve heat transfer rate effectively, but the effect of heat transfer of Al foam is superior to that of graphite foam although the heat storage capacity is almost the same for both. The heat transfer is enhanced and the solidification time of PCM is decreased since the effective thermal conductivity of composite PCM is increased.

• Periodical: Advanced Materials Research (Volumes 860-863)
• Pages: 590-593
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.860-863.590
• Online since: December 2013
• Authors: Cha Xiu Guo, Ding Bao Wang, Gao Lin Hu
• Keywords: PCM, Porosity Materials, Thermal Conductivity Enhancement

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