Laser Cold Ablation as a Cutting Edge Method of Forming Silicon Wafers Used in Solar Cells

Abstract:

The article shows experimental results of mild cutting of surface layers of polycrystalline silicon photovoltaic cells with a picoseconds UV laser. Current technology makes a strong point on reliability and quality of photovoltaic microprocessing. Using short impulse lasers guarantee best quality of cutting edge without burr, HAZ and changing crystalline structure of the base material, with is very important due to electrical conductivity of the solar cell.

• Periodical: Advanced Materials Research (Volume 874)
• Pages: 113-118
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.874.113
• Online since: January 2014
• Authors: Piotr Sęk, Szymon Tofil*
• Keywords: Laser Cold Ablation, Silicon Wafers, Solar Cell

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