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A New Method for the Preparation of the Copper Bonding on Alumina Substrate

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Abstract:

A novel method to prepare the copper bonding on alumina substrate was presented. The cuprous Cu2O on the surface of Cu foil was prepared by covering cupric oxide (CuO) powder on Cu foil and treating at 600°C in N2 atmosphere. Then eutectic process was executed at 1075°C in N2 atmosphere to bond the Cu and alumina substrate. The cuprous grew on copper foil and bonding between Cu foil-alumina substrate were identified by XRD spectrum and SEM micrographs.

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Periodical:

Advanced Materials Research (Volumes 875-877)

Pages:

1495-1498

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.875-877.1495

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Online since:

February 2014

Authors:

Hao Tung Lin, Chien Cheng Liu, Kuang I Liu

Keywords:

Alumina, Cuprous, Oxidation

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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