Design of the Temperature Field Test System of Power Electronic Packaging Modules

Jun Hua; Peng Yun Jin; Li Bing Zheng; Hua Chao Fang; Chun Lei Wang; Li Han; Ping Song

doi:10.4028/www.scientific.net/AMR.875-877.1929

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 875-877Design of the Temperature Field Test System of...

Design of the Temperature Field Test System of Power Electronic Packaging Modules

Abstract:

The defects of material, packaging process and layout in power electronic packaging modules can affect the temperature distribution. Defects such as the voids of the welding and the unreasonable layout will cause uneven distribution of the temperature field in the internal surface and the local hot spots will emerge. If the hot spots continued, the module will be damaged. In order to achieve the defect analysis based on the temperature field, a test system is designed. The infrared camera is used to measure the temperature distribution in the system. The system can test the temperature field distribution characteristics with different loads. The study provided a strong basis of defect analysis standards based on temperature field.

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Periodical:

Advanced Materials Research (Volumes 875-877)

Pages:

1929-1933

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.875-877.1929

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Online since:

February 2014

Authors:

Jun Hua, Peng Yun Jin, Li Bing Zheng, Hua Chao Fang, Chun Lei Wang, Li Han, Ping Song

Keywords:

Defect Analysis, Power Electronic Packaging Module, Temperature Field

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References

[1] Jun He, Vivek Mehrotra and Michael C Shaw. Thermal Design and Measurements of IGBT Power Modules: Transient and Steady State[C]. Industry Applications Conference, 1999, 2: 1440~1444.

DOI: 10.1109/ias.1999.801689

Google Scholar

[2] Peterson G P, Duncan A B, et al. Experimental investigation of micro heat pipes fabricated in silicon wafers[J]. Journal of Heat Transfer, 1993, 3(115): 751~756.

DOI: 10.1115/1.2910747

Google Scholar

[3] Thomas K P, Webb P W. Simulation and measurement of the temperature rise in a power semiconductor device under transient conditions[C]. Proceedings of the 1997 IEEE Colloquium on Modeling and Simulation for Thermal Management, 1997, (43): 51~56.

DOI: 10.1049/ic:19970270

Google Scholar

[4] Kim Q, Kayali S. Infrared Emission Spectroscopy as a Reliability Tool[C]. Proceedings of the 25th International Symposium for Testing and Failure Analysis, 1999: 77-83.

DOI: 10.31399/asm.cp.istfa1999p0077

Google Scholar

[5] Bruckner Thomas, Bernet Steffen. Estimation and measurement of junction temperatures in a three-level voltage source converter[C]. 2005 IEEE Industry Applications Conference, 2005: 106~114.

DOI: 10.1109/ias.2005.1518299

Google Scholar