Design of Lead-Free Solders and Pollution Control of Lead

Gui Sheng Gan; Chang Hua Du; Chun Tian Li

doi:10.4028/www.scientific.net/AMR.881-883.1435

Paper Titles

Experimental Study of Electron Beam Welded QCr0.8 Bronze Joint
p.1416

Finite Element Analysis of Rolling Process for Pilger Mill
p.1420

Surface Modification of Magnesium Hydroxide by A-174 Silane
p.1424

The Impact of Sinter and Thermoprint on Film Formation of nanoTiO2 Slurry
p.1431

Design of Lead-Free Solders and Pollution Control of Lead
p.1435

Research on the Coating Surface Microstructure of Coated Paper Related to Binder Migration
p.1439

Effects of Thermal Transfer Paper Performance on Transfer Quality
p.1443

Finite Element Analysis of Temperature Filed and Stress Field of Reducer
p.1447

Describing the Influence of Ink Type on Ink Penetration and Distribution
p.1451

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 881-883Design of Lead-Free Solders and Pollution Control...

Design of Lead-Free Solders and Pollution Control of Lead

Abstract:

Due to increase refined lead production and slow industrialization of lead-free solders, hazard of lead to human and environment still existed. Based on pollutions of lead depending on the volatility and the solubility of lead, the new ways to prevent and reduce the pollution of lead were put forward. The lead content in lead-solders could be reduced appropriately and the dense surface film could be formed by micro-alloying in the view of material for reducing the pollution. Low soldering temperature and the optimal soldering process or equipment could also be taken to reduce the pollution of lead.

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Periodical:

Advanced Materials Research (Volumes 881-883)

Pages:

1435-1438

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.881-883.1435

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Online since:

January 2014

Authors:

Gui Sheng Gan, Chang Hua Du, Chun Tian Li

Keywords:

Lead-Free, Soldering Process, Solubility, Volatility

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