Structure Improvement and Performance Analysis of a Coupling Component for Board-Level Photoelectric Interconnection

Jin Bo Yan; Zhao Hua Wu; De Jin Yan

doi:10.4028/www.scientific.net/AMR.886.361

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 886Structure Improvement and Performance Analysis of...

Structure Improvement and Performance Analysis of a Coupling Component for Board-Level Photoelectric Interconnection

Abstract:

The paper took a structure improvement of a coupling component for board-level photoelectric interconnection and analyzed its coupling efficiency by stimulation. Firstly, it briefly introduced the commonly used coupling components, analyzed the coupling performance, and selected a coupling component to improve its structure. Secondly, it introduced methods to improve coupling components, such as 45-degree gold-plated cross section, and manufacturing ball lens on both the top and the bottom to increase the coupling efficiency of coupling components. Finally, the optical simulation software Advanced Systems Analysis Program was applied to analyze the coupling efficiency. The coupling efficiency of improved coupling component was increased. The analyses and results are significant in engineering application and guiding.

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Periodical:

Advanced Materials Research (Volume 886)

Pages:

361-364

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.886.361

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Online since:

January 2014

Authors:

Jin Bo Yan*, Zhao Hua Wu, De Jin Yan

Keywords:

Alignment Tolerance, Board-Level Photoelectric Interconnection, Coupling Component

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