Effect of Microscopic Structure on High-Cycle Fatigue Behavior in Nano-Components

Takashi Sumigawa; Kenta Matsumoto; Takayuki Kitamura

doi:10.4028/www.scientific.net/AMR.891-892.1705

Paper Titles

Mechanics of Fatigue Crack Propagation in Submicron-Thick Freestanding Copper Films
p.1681

Fatigue and Damage Tolerance Substantiation Approach for a Regional Jet
p.1688

Analysis of the Fatigue Stress on Welded Joints of the U-Rib in an Orthotropic Steel Deck
p.1694

Evaluation of the Serviceability of the Transverse Joint of a Modular Bridge under a Cyclic Load
p.1699

Effect of Microscopic Structure on High-Cycle Fatigue Behavior in Nano-Components
p.1705

Plastic Slip and Early Stage of Fatigue Damage in Polycrystals: Comparison between Experiments and Crystal Plasticity Finite Elements Simulations
p.1711

Wavelet-Based Feature Extraction Algorithm for Fatigue Strain Data Associated with the k-Means Clustering Technique
p.1717

Fatigue Behavior and Surface Sensitivity of Board-Shaped Sample of Powder Metallurgy FGH 96
p.1723

Prediction of Fatigue Crack Growth of Aged Hardening Al-Alloys under Variable Amplitude Loading
p.1729

HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 891-892Effect of Microscopic Structure on High-Cycle...

Effect of Microscopic Structure on High-Cycle Fatigue Behavior in Nano-Components

Abstract:

In order to investigate the effect of microscopic structure on fatigue behavior of nanoscale components, a resonant fatigue experiment is conducted using a nanocomponents specimen where the test section is composed of a single crystalline Si substrate, a 200 nm thickness Cu polycrystalline film and a SiN amorphous layer. In the specimen, only the Cu portion plastically deforms because the yield stress is lower than those of other materials. The shape and the crystalline orientation of each grain on the surface of Cu portion are specified by means of EBSD. Although crystallographic slip bands with a width of a few tens of nanometers appear only in a grain of Cu portion, the grain is different from that expected by the Schmid factor. A FEM analysis, which takes into account the deformation anisotropy of grains, reveals that shear stress to generate slip bands is concentrated on the grain owing to the deformation constraint by neighboring crystals and components.

You might also be interested in these eBooks

View Preview

Info:

Periodical:

Advanced Materials Research (Volumes 891-892)

Pages:

1705-1710

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.891-892.1705

Citation:

Cite this paper

Online since:

March 2014

Authors:

Takashi Sumigawa*, Kenta Matsumoto, Takayuki Kitamura

Keywords:

Copper, High Cycle Fatigue (HCF), Nanoscaled Polycrystalline Material, Resolved Shear Stress, Slip Band, Stress Field

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

Citation:

* - Corresponding Author

References

[1] P.J.E. Forsyth, Exudation of material from slip bands at the surface of fatigued crystals of an aluminum copper alloy, Nature. 171 (1953) 172-173.

DOI: 10.1038/171172a0

Google Scholar

[2] Ma. Bao-Tong, C. Laird, Overview of fatigue behavior in copper single crystals—I. Surface morphology and stage I crack initiation sites for tests at constant strain amplitude, Acta Metallurgica. 37(2) (1989) 325-336.

DOI: 10.1016/0001-6160(89)90217-4

Google Scholar

[3] T. Sumigawa, T. Kitamura, K. Ohishi, Slip behaviour near a grain boundary in high-cycle fatigue of poly-crystal copper, fatigue & fracture of engineering materials and structures. 27 (2004) 495-503.

DOI: 10.1111/j.1460-2695.2004.00776.x

Google Scholar

[4] T. Sumigawa, R. Shiohara, K. Matsumoto, T. Kitamura. Characteristic features of slip bands in submicron single-crystal gold component produced by fatigue, Acta Materialia. 61 (2013) 2692-2700.

DOI: 10.1016/j.actamat.2013.01.053

Google Scholar

[5] G.P. Zhang, K.H. Sun, B. Zhang, J. Gong, C. Sun, Z.G. Wang, Tensile and fatigue strength of ultrathin copper films, Materials Science and Engineering A. 483–484 (2008) 387–390.

DOI: 10.1016/j.msea.2007.02.132

Google Scholar

[6] R. Schwaigery, G. Dehm and O. Kraftz, Cyclic deformation of polycrystalline Cu films, Philosophical Magazine. 83(6) (2003) 693–710.

DOI: 10.1080/0141861021000056690

Google Scholar

[7] S. Iida, K. Ohno, H. Kamimae, H. Kumagai, S. Sawada, Tables of physical constraints, Asakura-shoten, Tokyo, Japan, (1992).

Google Scholar

[8] D. Melisova, B. Weiss, R. Stickler, Nucleation of persistent slip bands in Cu single crystals under stress controlled cycling, Scripta Materialia. 36(9) (1997) 1061-1066.

DOI: 10.1016/s1359-6462(96)00478-2

Google Scholar