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Thermal, Mechanical and Dielectric Properties of Silicon Carbide/Polyphenylene Sulfide Composites
Abstract:
The functionalized silicon carbide (SiC) fillers are employed to fabricate silicon carbide/polyphenylene sulfide (PPS) composites by mechanical ball milling-compression molding method. The thermal conductive coefficient of the SiC/PPS composites with 40 wt% functionalized SiC is 0.934 W/ mK, 4 times higher than that of the original PPS. The mechanical properties of SiC/PPS composites are optimal with 5 wt% addition of SiC. Both the heat resistant and dielectric properties of the SiC/PPS composites are increased with the increasing addition of SiC. For a given SiC loading, the surface functionalization of SiC can improve the thermal conductivities and mechanical properties of the SiC/PPS composites simultaneously.
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209-212
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Online since:
February 2014
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© 2014 Trans Tech Publications Ltd. All Rights Reserved
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