Dynamic Analysis and Optimization for Wafer Handling Robot

Ming Yue Wu; Yan Jie Liu; He Gao Cai

doi:10.4028/www.scientific.net/AMR.898.657

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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 898Dynamic Analysis and Optimization for Wafer...

Dynamic Analysis and Optimization for Wafer Handling Robot

Abstract:

Aiming at suppressing the vibration of low-frequency, a procedure of dynamic optimization of wafer handling robot is presented. The dynamic model of wafer handling robot is firstly build, and following that the dynamic characteristics of the robot are analyzed to find the main parameters which will influence the natural frequency. Then, the numerical procedure of the optimization of the natural frequency is introduced, and the constraint functions are obtained by considering the workspace and the structure of the robot. And at the end, as a case study, the procedure is applied to a wafer handling robot. Optimization result shows that the natural frequency is enhanced to 32.56Hz after the optimization.

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Periodical:

Advanced Materials Research (Volume 898)

Pages:

657-662

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.898.657

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Online since:

February 2014

Authors:

Ming Yue Wu*, Yan Jie Liu, He Gao Cai

Keywords:

Dynamic optimization, Natural Frequency, Numerical Analysis, Wafer Handling Robot

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