Study on the Double Pulse Laser Dynamic Electronic Speckle Measurement Based on FPGA

Abstract:

Speckle pattern interferometry can be used to measure he displacement, strain and vibration, surface deformation and surface roughness. And dynamic laser speckle measurement with high accuracy has been widely used in measurement of surface deformation. Tool breakage is the main bottleneck of high-speed intermittent cutting development, therefore, obtaining stress distribution of milling tools is a base of improving the tool design and tool life. Using a speckle measurement method of double pulsed digital based on FPGA, which involves the laser cutter, tools and CCD, transforms the high-speed dynamic measurement to quasi-static measurement. As a result, we can get two speckle images of front and back milling cutter surface and calculate the deformation ,strain and stress distribution of the tool surface with analysis.

• Periodical: Advanced Materials Research (Volume 900)
• Pages: 617-622
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.900.617
• Online since: February 2014
• Authors: Fu Sheng Yu*, Teng Fei Li, Yan Chao Wu, Zhong Guo Sun, Sheng Jiang Yin
• Keywords: Double Pulse Laser, FPGA, Speckle, Tool

References

[1] Chuan Zhong, Changyu Shen, Zhaoxiang Lin, Ke Li: Plane displacement measurement of rigid body by laser speckle , Journal of China Jiliang University. 2011, 3(22): 11-13.

[2] Xing Ai, Jun Zhao, Zhanqiang Liu: Promote the ceramic cutting tool research on the international advanced level, China mechanical engineering. 1999, 10(9): 1033-1035.

[3] Pin Sun, Yunshan Wang, Yandi Geng: The deformation of tool online speckle measurement , Journal of Experimental Mechanics. 1997, 12(1): 157-161.

[4] Changku Sun, Shenghua Ye: Laser measurement technology. 2000, 10: 64-67.

[5] Kaifu Wang, Minghui Gao, Speckle metrology,. 2010, 10: 94-96.