[1]
F. -G. Tseng, C. -J. Kim, and C. -M. Ho, Journal of Microelectromechanical Systems, vol. 11, (2002), pp.427-36.
Google Scholar
[2]
T. J. Yen, N. Fang, X. Zhang, G. Q. Lu, and C. Y. Wang, Applied Physics Letters, vol. 83, (2003), pp.4056-8.
Google Scholar
[3]
D. R. Meldrum and M. R. Holl, Science, vol. 297, (2002), pp.1197-8.
Google Scholar
[4]
P. -A. Auroux, D. Iossifidis, D. R. Reyes, and A. Manz, Analytical Chemistry, vol. 74, (2002), pp.2637-52.
Google Scholar
[5]
S. Shoji and M. Esashi, Journal of Micromechanics and Microengineering, vol. 4, (1994)pp.157-71.
Google Scholar
[6]
Roya Sheybani and Ellis Meng, Journal of Microelectromechanical Systems, Vol. 21, No. 5, (2012), pp.1197-207.
Google Scholar
[7]
J. Xie, J. Shih, Q. Lin, B. Yang, and Y. -C. Tai, Lab on a Chip, vol. 4, (2004), pp.495-501.
Google Scholar
[8]
D. J. Laser and J. G. Santiago, Journal of Micromechanics and Microengineering, , vol. 14, (2004), p. R35-R64.
Google Scholar
[9]
J. -H. Tsai and L. Lin, Journal of Microelectromechanical Systems, vol. 11, (2002), pp.665-71.
Google Scholar
[10]
X. Geng, H. Yuan, H. N. Oguz, and A. Prosperetti, Journal of Micromechanics and Microengineering, vol. 11, (2001), pp.270-6.
Google Scholar
[11]
C. -J. Kim, Proc. Int. Semiconductor Device Research Symp., Charlottesville, VA, Dec., (1999), pp.481-4.
Google Scholar
[12]
M. E. Steinke and S. G. Kandlikar, ASME Journal of Heat Transfer , vol. 126, (2004), pp.518-26.
Google Scholar
[13]
L. Lin, Microscale Thermophysical Engineering, , vol. 2, (1998), pp.71-85.
Google Scholar
[14]
D. -S. Meng, Yongho Ju and C. -J Kim, The 13th Int. Conf. on Solid-State Sensors, Actuators and Microsystems, Seoul, Korea, June , (2005), pp.1263-66.
Google Scholar
[15]
A. P. Papavasiliou, A. P. Pisano, and D. Liepmann, The 11th Int. Conf. on Solid-State Sensors, Actuators and Microsystems, Munich, Germany, Jun., (2001), pp.940-3.
Google Scholar