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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 926-930Electroless Nickel Plating on Copper Foil

Electroless Nickel Plating on Copper Foil

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Abstract:

A pre-cleaning and an electroless nickel plating (EN-HP) were applied to copper foil to improve its tribological behaviour and corrosion resistance. The coating porosity was measured by the corrodkote, tribological behaviour was measured with microhardness tester and a CSM ball-on-disk tribometer, corrosion resistance was measured by potentiodynamic polarization in 3.5 wt.% NaCl solution. Matte nickel plating (mNi) and moderate compact Ni–P coating (EN-MP) were made as comparisons to EN-HP in those tests. By deposition of EN-HP, both coating porosity and tribological behaviour are greatly improved compared to mNi, and the corrosion resistance is distinctly ameliorated to the comparisons. Above research demonstrates that the copper foil with EN-HP coating is good underlay in assemblage of machine.

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Progress in Applied Sciences, Engineering and Technology

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Periodical:

Advanced Materials Research (Volumes 926-930)

Pages:

103-107

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.926-930.103

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Online since:

May 2014

Authors:

Zuo Qin Tang, Su Rong Hu*, Yin Chun Chao

Keywords:

Copper Foil, Corrosion Resistance, Electroless Nickel Plating, Porosity, Tribological Behaviour

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© 2014 Trans Tech Publications Ltd. All Rights Reserved

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