Application of Thermal Contact Resistance in Simulation of Heat Dissipation by CPU Heat Sinks Based on ANSYS

Abstract:

With development in electronic technology, more and more electronic elements have been integrated into one chip, which has resulted in the cooling problem of the chips. In this case, heat dissipation has become the main factor that affecting the design reliability and package cost. Therefore, good heat dissipation designs are urgently need to solve the problem. An important issue resulted from simulation of heat dissipation is the determination of boundary condition between the heat sink and the CPU. The concept of thermal contact resistance was introduced to simulation of heat dissipation of CPU heat sinks in this paper. The temperature distribution of CPU heat sinks was calculated Based on ANSYS software. The result of calculation can help to understand the heat transfer characteristics of CPU heat sinks, and also offer a reference for the design and improvement of the electronic equipment.

• Periodical: Advanced Materials Research (Volumes 941-944)
• Pages: 2465-2468
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.941-944.2465
• Online since: June 2014
• Authors: Yong Zhen Liu, Zhi Shi Huang, Bin Feng, Jin He Wei, Jian Min Zeng
• Keywords: ANSYS, CPU Heat Sinks, Thermal Analysis, Thermal Contact Resistance

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