Effect of Copper Micro-Scale Excess on the Dielectric Properties of CaCu3Ti4O12 Ceramics Prepared via Tape Casting

Article Preview

Abstract:

CaCu(3+ x)Ti4O12 (x = 0, 0.001, 0.002, 0.004 and 0.008) ceramics with variation in copper micro-scale excess were prepared via solid-state reaction, Aqueous technology of tape casting was applied to obtain thick films of, about 100 μm in thickness. Crystal phases of the samples were identified by XRD. SEM of samples revealed that copper micro-scale excess can accelerate some important solid phase reactions in the sintering process, most because of liquid phase sintering mechanism. EDX analysis indicated that copper micro-scale excess could compensate for a lack of copper in sintering process. The Cu3.004 sample exhibited the best dielectric properties with a very low dielectric loss (0.029), while retaining a very high dielectric constant (91,536), and the Cu3.002 and Cu3.004 samples exhibited a well frequency and temperature stability which was of significant industrial relevance. In this work, it was concluded that a certain amount of Cu micro-scale excess could improve dielectric properties, frequency stability and temperature stability of CCTO ceramics.

You might also be interested in these eBooks

Info:

Periodical:

Advanced Materials Research (Volumes 941-944)

Pages:

517-520

Citation:

Online since:

June 2014

Export:

Price:

Permissions CCC:

Permissions PLS:

Сopyright:

© 2014 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

* - Corresponding Author

[1] M.A. de la Rubia, P. Leret, J. de Frutos and J.F. Fernández: J. Am. Ceram. Soc., Vol. 95 (6) (2012), pp.1866-1870.

DOI: 10.1111/j.1551-2916.2012.05144.x

Google Scholar

[2] M. Subramanian, D. Li, N. Duan, B. Reisner and A. Sleight: J. Solid State Cherm., Vol. 151 (2) (2000), pp.323-325.

Google Scholar

[3] W. Kobayashi and I. Terasaki: Appl. Phys. Lett., Vol. 87 (3) (2005), pp.032902-032903.

Google Scholar

[4] H. Yu, H. Liu, H. Hao, D. Luo and M. Cao: Mater. Lett., Vol. 62 (8) (2008), pp.1353-1355.

Google Scholar

[5] D.C. Sinclair, T.B. Adams, F.D. Morrison and A.R. West: Appl. Phys. Lett., Vol. 80(12) (2002), pp.2153-2155.

Google Scholar

[6] C. Puchmark and G. Rujijanagul: Nanoscale Res. Lett., Vol. 7 (1) (2012), pp.1-7.

Google Scholar

[7] D. Capsoni, M. Bini, V. Massarotti, G. Chiodelli, M. Mozzatic and C. Azzoni: J. Solid State Cherm., Vol. 177 (12) (2004), pp.4494-4500.

DOI: 10.1016/j.jssc.2004.09.009

Google Scholar

[8] P. Thomas, K. Dwarakanath and K. Varma: J. Eur. Ceram. Soc., Vol. 32 (8) (2012), pp.1681-1690.

Google Scholar