Development of Piezoelectric Three-Dimensional Dynamometer for Φ300mm Wafer Grinder

Jun Zhang; Wei Wang; Min Qian; Ren Ke Kang; Zong Jin Ren

doi:10.4028/www.scientific.net/AMR.945-949.2017

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 945-949Development of Piezoelectric Three-Dimensional...

Development of Piezoelectric Three-Dimensional Dynamometer for Φ300mm Wafer Grinder

Abstract:

Due to the requirements of on-line detection of grinding force in the grinding process, this paper utilizes the structural characteristics of ultra-precision grinder with double-spindle and single-workstation, and then presents a grinding dynamometer based on piezoelectric effect of quartz crystals. Besides, the grinder dynamometer can measure grinding force in three directions, and the static properties of dynamometer are experimentally tested in a special experiment table. Moreover, the on-line static calibration and the actual grinding experiment of dynamometer installed in the silicon wafer grinder are performed. The results indicate that the grinding dynamometer has satisfactory static properties, that is, the linearity and repeatability are less than 1%, and the cross-talks are also less than 5%. As a result, each indicator has full reached the operating requirements in using of large diameter silicon wafer grinding force measuring.

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Periodical:

Advanced Materials Research (Volumes 945-949)

Pages:

2017-2020

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.945-949.2017

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Online since:

June 2014

Authors:

Jun Zhang*, Wei Wang, Min Qian, Ren Ke Kang, Zong Jin Ren

Keywords:

Dynamometer, Grinding Force, Piezoelectric Effect, Static Calibration

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References

[1] H.K. Tönshoff, T. Friemuth, J.C. Becker: Process monitoring in grinding. Annals of the CIRP, 51 (2) (2002), pp.1-21.

DOI: 10.1016/s0007-8506(07)61700-4

Google Scholar

[2] Zhu Xianglong, Design and Development of Ultra-precision Grinder for 300mm Wafer. Dalian University of Technology, (2011).

Google Scholar

[3] Bo Liu, A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-precision Grinding of Silicon Wafers. Dalian University of Technology, (2010).

DOI: 10.4028/www.scientific.net/amr.126-128.707

Google Scholar

[4] Pei Z J, Strasbaugh A. Fine grinding of silicon wafers: designed experiments [J]. International Journal of Machine Tools & Manufacture. 2002, 42(08): 395-404.

DOI: 10.1016/s0890-6955(01)00123-7

Google Scholar

[5] Couey J A, Eric R. Marsh, et al. In-process force monitoring for precision grinding semiconductor silicon wafers [J]. Int. J. Manuf. Technol. Manag. 2005, 7 (5/6): 430.

DOI: 10.1504/ijmtm.2005.007695

Google Scholar

[6] Michael B. Ball, Boise, Id. Method and apparatus for grinding wafers [P]. US Patent, 5827111, Oct. 27, (1998).

Google Scholar