The Bending Forming Mechanism of Copper Alloy by Different Lasers

Abstract:

By FEA method, the bending of the copper alloy thin-plates by continuous laser forming (CLF) and pulse laser forming (PLF) was studied. Based on the analysis of dynamic change and steady distribution for the fields of temperature, stress/strain and displacement, the forming mechanism and rule of copper alloy by different laser modes were revealed. The whole deformation of PLF was the additive effect of all impulse action, while CLF mainly was the result of thermal stress. To get the same deformation, laser pulse energy is about 6 times of the continuous laser，CLF is suitable for larger deformation demands, and PLF is more seemly for micro-forming.

• Periodical: Advanced Materials Research (Volume 968)
• Pages: 142-145
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.968.142
• Online since: June 2014
• Authors: Su Qin Jiang*, Ai Hui Liu, Xiao Xue Wang, Zhong Chen
• Keywords: Bending Forming, Copper Alloy, Laser Mode, Numerical Analysis

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