Thermal Properties of Silicon-Containing Polyimide Filled with Carbon Black of Low Structure

Sunan Tiptipakorn; Sarawut Rimdusit; Sarote Phromdee; Kasinee Hemvichian

doi:10.4028/www.scientific.net/AMR.968.21

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Thermal Properties of Silicon-Containing Polyimide Filled with Carbon Black of Low Structure
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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 968Thermal Properties of Silicon-Containing Polyimide...

Thermal Properties of Silicon-Containing Polyimide Filled with Carbon Black of Low Structure

Abstract:

The nanocomposites between silicon-containing polyimide (SPI) and electrically conductive carbon black (CB) of low structure (Conductex K Ultra) were prepared. The contents of the conductive nanofillers were varied from 0 to 40 phr. The thermal properties of the nanocomposites were determined via Differential Scanning Calorimeter (DSC) and Thermo-gravimetric Analyzer (TGA). DSC thermograms revealed that the glass transition temperature (T_g) and degradation temperature (T_d) of the nanocomposites increased with increasing the amount of fillers. The T_g and T_d values of the composites filled with high structure were higher than those of the ones filled with low structure.