Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints

Yong Cheng Lin; Jing Hong Lu; Jun Zhang

doi:10.4028/www.scientific.net/AMR.97-101.3963

Paper Titles

Theoretical Study on Stress State in Adhesive Layer of Single Lap Joint under Eccentric Tensile Load
p.3944

The Arc Sound Characteristic on MIG Weld Penetration
p.3948

Study on Fuzzy Controller of Welding Arc Length
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Microstructures and Mechanical Properties on Laser Welded Joints of Automotive High Strength Complex Phase Steel
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Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints
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Research on Laser Full-Penetration Welding In Situ TiB₂ Particulate Reinforced ZL101 Composites
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Characteristics of Underwater Swirling Plasma Arc Cut Quality
p.3974

Weld Pool Shape Variations and Electrode Protection in Double Shielded TIG Welding
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Investigation of UV Light Intensity Distribution of Integral Micro-Stereolithography System
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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 97-101Numerical Simulation for the Thermal Fatigue of...

Numerical Simulation for the Thermal Fatigue of Flip Chip Solder Joints

Abstract:

Fatigue failure of solder joints is a serious reliability concern in area array technologies. A non-linear finite element model was made to study the effects of underfill material and substrate flexibility on solder joint thermal fatigue. Accelerated temperature cycling loading was imposed to evaluate the reliability of solder joints in test flip chip assembly. The results show that the underfill material and substrate flexibility can improve the distribution of stress/strain and reduce the magnitude of stress/strain in the solder joints. Therefore, the reliability of solder joints under thermal cycling condition can be enhanced by applying underfill material and selecting the Flex substrates during temperature cycling.

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Periodical:

Advanced Materials Research (Volumes 97-101)

Pages:

3963-3966

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.97-101.3963

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Online since:

March 2010

Authors:

Yong Cheng Lin, Jing Hong Lu, Jun Zhang

Keywords:

Fatigue Life, Finite Element Analysis (FEA), Flip Chip, Solder Joint

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