Residual Stress Measurement with Laser-Optical and Mechanical Methods

Abstract:

A new approach in hole-drilling residual stress analysis is described, applying a laser for quasi non-destructive material removal by laser ablation and measuring simultaneously the residual deformation around the hole by means of high-resolution, digital holographic interferometry. To evaluate this technology, experiments measuring well-defined in-plane stresses in curved strip specimen, on experimental bending device based on the European Standard for four-point bending tests, were carried out with the conventional hole drilling and milling technique and the laser-optical technique described.

• Periodical: Advanced Materials Research (Volume 996)
• Pages: 256-261
• DOI: https://doi.org/10.4028/www.scientific.net/AMR.996.256
• Online since: August 2014
• Authors: Venancio Martínez-García*, Martin Wenzelburger, Andreas Killinger, Giancarlo Pedrini, Rainer Gadow, Wolfgang Osten
• Keywords: Digital Holographic Interferometry, Hole-Drilling Method, Laser, Layer Composites, Residual Stress, Thermal Spraying

References

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