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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 996Phase Transformation in Ultra-Thin Films

Phase Transformation in Ultra-Thin Films

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Abstract:

Thickness dependent structural phase transformation in thin polycrystalline metal films has been reviewed. Various effects of film thickness reduction on film microstructure have been identified. Film thickness dependent structural phase transformation has been treated thermodynamically taking polycrystalline titanium (Ti) thin film as model example.

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Residual Stresses IX

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Periodical:

Advanced Materials Research (Volume 996)

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860-865

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.996.860

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Online since:

August 2014

Authors:

Jay Chakraborty*

Keywords:

Film Thickness, Gibbs Free Energy, Phase Transformation, Thin Film

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[1] P. M. Marcus, F. Jona, J. Phys. Condens. Matter, 9 (1997) 6241-6246.

[2] P. Hemenger, H. Weik, Acta Cryst. 19 (1965) 690-691.

[3] D. Van Heerden, D. Josell and D. Shechtman, Acta Mater. 44 (1996) 297-306.

[4] J. Chakraborty, Kishor Kumar, Rajeev Ranjanm S. Ghosh Chowdhury and S. R. Singh, Acta Mater. 59 (2011) 2615-2623.

[5] Rajarshi Banerjee, Suliman A. Dregia, Hamish L. Fraser, Acta Mater. 47 (1999) 4225-4231.

[6] G. Grimvall, B. M-Kope, V. Ozolins, K. A. Persson, Reviews of Modern Physics, 84 (2012) 945-986.

[7] H. Windischmann, Crit. Rev. Solid State Mater. Sci. 17 (1992) 547.

[8] J. Chakraborty, Kishor Kumar, S. Mukherjee, S. K. Ray, Thin Solid Films, 516 (2008) 8479-8486.

[9] R. Banerjee, E. A. Sperling, G. B. Thompson, H. L. Fraser, S. Bose, P. Auyub, Appl. Phys. Lett. 82 (2003) 4250-4252.

[10] J. Sheng, U. Welzel, E. J. Mittemeijer, Appl. Phys. Lett. , 97 (2010) 153109-1-153109-3.

DOI: 10.1063/1.3500827

[11] A. Aguayo, G. Murrieta, R. de. Coss, Phys. Rev. B 65 (2002) 092106.

[12] WD Nix, Metall Trans 20A (1989) 2217.

[13] CV Thompson, Annu. Rev. Mater. Sci., 20 (1990) 245.

[14] Carl. V. Thompson, Roland Carel, Mater. Sci. and Engg. B32 (1995) 211-219.

[15] I. C. Noyan, J. B. Cohen Residual Stress, (Springer-Verlag New York Inc. 1987).

[16] AT Paxton, M. Methfessel, HM Polatogiou, Phys. Rev. B 41 (1990) 8127.