Design and Optimization of an Injection-Moldable Force-Fit Interconnection Module for Smart Textile Applications

Abstract:

This work presents a polymer based force-fit interconnection module (Click-Bond) that can be used to establish reliable electrical and mechanical interconnections between electronic components and textile circuit boards at room temperature. It is an extremely fast and cost-efficient process that is able to bring smart textile applications into the mass market. The semi-crystalline polymer POM-C is selected as material. It has good physical properties and can be used in injection molding. After the design is made mechanical experiments are performed to analyze the maximum forces and stress relaxation of the modules. Additionally, the compressibility of fabrics is analyzed to be able to design the module to apply a certain pressure. Finally, a multi-terminal board is presented that allows to easily integrate more complex electronics boards into smart textiles.

• Periodical: Advances in Science and Technology (Volume 80)
• Pages: 96-101
• DOI: https://doi.org/10.4028/www.scientific.net/AST.80.96
• Online since: September 2012
• Authors: Erik P. Simon, Moritz Fröhlich, Ch. Kallmayer, K. D. Lang
• Keywords: Conductive Yarn, Contact Resistance, Crimp Interconnection, Force-Fit Interconnection, Smart Textiles

References

[1] T. Linz et al., Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics, presented at the BSN, Cambridge, MA, Apr. (2006).

DOI: 10.1109/bsn.2006.26

[2] Ch. Kallmayer, E. Simon, Large Sensor Integration in Textiles, 9th International Conference on Systems, Signals and Devices (SSD), Chemnitz, March 20-23, (2012).

DOI: 10.1109/ssd.2012.6198112

[3] T. Linz, E. P. Simon, H. Walter, Fundamental Analysis of Embroidered Contacts for Electronics in Textiles, Electronic System-Integration Technology Conference (ESTC), Berlin, September 13-16, (2010).

DOI: 10.1109/estc.2010.5642823

[4] T. Linz, M. von Krshiwoblozki, H. Walter, Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding, presented at the BSN, Singapore, Jun. (2010).

DOI: 10.1109/bsn.2010.56

[5] R. Vieroth et al., Stretchable Circuit Board Technology and Application, Presented at the ISWC, Linz, Austria, Sep. (2009).

[6] E.P. Simon, Ch. Kallmayer, R. Aschenbrenner, K. -D. Lang, Novel Approach for Integrating Electronics into Textiles at Room Temperature using a Force-Fit Interconnection, European Microelectronics Packaging Conference (EMPC), Brighton, UK, September 12-15, (2011).

[7] Information on http: /www. gruenberg-kunststoffe. de/images/stories/produkt-pdf/POM/POM%20Werkstoffkennwerte. pdf.