CuNi-NiCr Interdiffusion by Measurement of Thin Film Electrical Resistance and Mechanical Stress

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Periodical:

Defect and Diffusion Forum (Volumes 129-130)

Edited by:

D.L. Beke and I.A. Szabó

Pages:

293-294

DOI:

10.4028/www.scientific.net/DDF.129-130.293

Citation:

W. Brückner and H. Grieβmann, "CuNi-NiCr Interdiffusion by Measurement of Thin Film Electrical Resistance and Mechanical Stress", Defect and Diffusion Forum, Vols. 129-130, pp. 293-294, 1996

Online since:

March 1996

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$35.00

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