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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 129-130CuNi-NiCr Interdiffusion by Measurement of Thin...

CuNi-NiCr Interdiffusion by Measurement of Thin Film Electrical Resistance and Mechanical Stress

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Diffusion and Stresses (International Workshop)

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Periodical:

Defect and Diffusion Forum (Volumes 129-130)

Pages:

293-294

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.129-130.293

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Online since:

March 1996

Authors:

W. Brückner, H. Grieβmann

Keywords:

Interdiffusion, Stress Measurement, Thin Film

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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