Periodic Layer Formation during Solid State Reactions
p.253
p.253
Evidence for Pressure Effect on Impurity Segregation in Grain Boundaries and Interstitial Grain Boundary Diffusion Mechanism
p.269
p.269
Non-Stationary Diffusional Creep in Dispersion Strengthened Tungsten
p.279
p.279
Stress and Diffusion in a One-Component Viscous Continuum
p.281
p.281
Diffusion-Enhanced Deformation of a Circular Inclusion
p.289
p.289
CuNi-NiCr Interdiffusion by Measurement of Thin Film Electrical Resistance and Mechanical Stress
p.293
p.293
Interdiffusion and Stress, Free Boundary Problem for r - Component (r > 2) One Dimensional Mixture Showing Constant Concentration
p.295
p.295
Stationary Strain Field in Nonhomogeneous Solid Mixed Boundary Value Problem of the Navier Equation
p.297
p.297
Interdiffusion and Diffusional Structures in Multicomponent Alloys; The Mathematical Model for Thin Films
p.301
p.301
Diffusion-Enhanced Deformation of a Circular Inclusion
Abstract:
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Periodical:
Defect and Diffusion Forum (Volumes 129-130)
Pages:
289-292
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Online since:
March 1996
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© 1996 Trans Tech Publications Ltd. All Rights Reserved
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