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Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions
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Diffusion Induced Stresses as a Driving Force for the Instability of a Solid/Liquid Interface
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Influence of Mechanical Pressure on Ionic Charge Transport Across the Ag|Agl-Interface - Periodic Oscillations of Interfacial Properties
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Periodic Layer Formation during Solid State Reactions
p.253

Evidence for Pressure Effect on Impurity Segregation in Grain Boundaries and Interstitial Grain Boundary Diffusion Mechanism
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Non-Stationary Diffusional Creep in Dispersion Strengthened Tungsten
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Stress and Diffusion in a One-Component Viscous Continuum
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Diffusion-Enhanced Deformation of a Circular Inclusion
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 129-130Periodic Layer Formation during Solid State...

Periodic Layer Formation during Solid State Reactions

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Diffusion and Stresses (International Workshop)

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Periodical:

Defect and Diffusion Forum (Volumes 129-130)

Pages:

253-268

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.129-130.253

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Online since:

March 1996

Authors:

M.R. Rijnders, A.A. Kodentsov, Csaba Cserháti, J. van den Akker, F.J.J. van Loo

Keywords:

Diffusion Induced Stress, Interfacial Dynamics, Kirkendall Effect, Periodic Pattern

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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