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Diffusion Phenomena of Solid Phase Reactions in Thin Films Prepared by High Temperature Successive Deposition
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Activation Volume for the Oxidation in Finely Divided Vanadium Ferrites
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Internal Stress Evolution in Multicomponent Thin Metal Films under Electric Current
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Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions
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Diffusion Induced Stresses as a Driving Force for the Instability of a Solid/Liquid Interface
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 129-130Internal Stress Evolution in Multicomponent Thin...

Internal Stress Evolution in Multicomponent Thin Metal Films under Electric Current

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Diffusion and Stresses (International Workshop)

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Periodical:

Defect and Diffusion Forum (Volumes 129-130)

Pages:

215-224

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.129-130.215

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Cite this paper

Online since:

March 1996

Authors:

Leonid Klinger, A. Katsman, L. Levin

Keywords:

Diffusion, Electromigration, Internal Stress, Multicomponent Thin Films

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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