Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions

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Periodical:

Defect and Diffusion Forum (Volumes 129-130)

Edited by:

D.L. Beke and I.A. Szabó

Pages:

225-228

DOI:

10.4028/www.scientific.net/DDF.129-130.225

Citation:

E. E. Glickman "Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions", Defect and Diffusion Forum, Vols. 129-130, pp. 225-228, 1996

Online since:

March 1996

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$35.00

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