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Reaction Rates and Stresses during Solid State Amorphization in Nickel-Hafnium Diffusion Couples
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Diffusion Phenomena of Solid Phase Reactions in Thin Films Prepared by High Temperature Successive Deposition
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Activation Volume for the Oxidation in Finely Divided Vanadium Ferrites
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Internal Stress Evolution in Multicomponent Thin Metal Films under Electric Current
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Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions
p.225

Diffusion Induced Stresses as a Driving Force for the Instability of a Solid/Liquid Interface
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Influence of Mechanical Pressure on Ionic Charge Transport Across the Ag|Agl-Interface - Periodic Oscillations of Interfacial Properties
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Periodic Layer Formation during Solid State Reactions
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Evidence for Pressure Effect on Impurity Segregation in Grain Boundaries and Interstitial Grain Boundary Diffusion Mechanism
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HomeDefect and Diffusion ForumDefect and Diffusion Forum Vols. 129-130Electromigration in Metal Interconnects:...

Electromigration in Metal Interconnects: Electrical- and Stress Field Induced Diffusion in Small Dimensions

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Diffusion and Stresses (International Workshop)

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Periodical:

Defect and Diffusion Forum (Volumes 129-130)

Pages:

225-228

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.129-130.225

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Online since:

March 1996

Authors:

Evgeny E. Glickman

Keywords:

Electromigration, Stress Induced Diffusion, Thin Film

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© 1996 Trans Tech Publications Ltd. All Rights Reserved

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